H01L24/06- Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas.H01L24/04- Structure, shape, material or disposition of the bonding areas prior to the connecting process.H01L24/02- Bonding areas Manufacturing methods related thereto.chip-to-package, die-attach, "first-level" interconnects Manufacturing methods related thereto H01L24/01- Means for bonding being attached to, or being formed on, the surface to be connected, e.g.H01L24/00- Arrangements for connecting or disconnecting semiconductor or solid-state bodies Methods or apparatus related thereto.leads, terminal arrangements Selection of materials therefor H01L23/48- Arrangements for conducting electric current to or from the solid state body in operation, e.g.H01L23/58- Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g.H01L23/00- Details of semiconductor or other solid state devices.H01L- SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10.Status Active legal-status Critical Current Adjusted expiration legal-status Critical Links ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Publication of US20080267301A1 publication Critical patent/US20080267301A1/en Priority to US12/414,379 priority patent/US8198951B2/en Priority to US12/414,387 priority patent/US7902627B2/en Priority to US12/494,618 priority patent/US8441325B2/en Publication of US8049573B2 publication Critical patent/US8049573B2/en Application granted granted Critical Assigned to SKYWORKS SOLUTIONS, INC. Assignors: ETTER, BRETT, DUPUIS, TIMOTHY, ALFANO, DONALD E. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from US10/860,399 external-priority patent/US7421028B2/en Priority claimed from US10/860,519 external-priority patent/US7447492B2/en Priority claimed from US11/020,977 external-priority patent/US7376212B2/en Priority claimed from US11/064,413 external-priority patent/US7460604B2/en Priority claimed from US11/089,348 external-priority patent/US7302247B2/en Priority to US11/772,178 priority Critical patent/US8049573B2/en Application filed by Silicon Laboratories Inc filed Critical Silicon Laboratories Inc Priority to US12/060,049 priority patent/US8169108B2/en Priority to US12/165,011 priority patent/US7821428B2/en Priority to US12/164,998 priority patent/US7737871B2/en Assigned to SILICON LABORATORIES INC. Original Assignee Silicon Laboratories Inc Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Alfano Brett Etter Timothy Dupuis Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Granted Application number US11/772,178 Other versions US8049573B2 Google Patents US20080267301A1 - Bidirectional multiplexed rf isolator US20080267301A1 - Bidirectional multiplexed rf isolator
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